3D Bioplotter Research Papers

The increasing use of electronic devices raises concerns about resource availability and end-of-life management, particularly regarding conductors for interconnects and sensing elements. While gold and silver are the leading materials for interconnects, they pose challenges related to scarcity, cost, and toxicity. Zinc offers a promising alternative due to its good electrical conductivity, non-toxicity, abundance, and affordability. However, challenges in achieving high conductivity and waste generation from processing techniques like screen-printing remain. To address this, a zinc ink optimizes for 3D printing is proposed, using active zinc particles in a shellac matrix. The methods, including chemical and photonic sintering, achieve conductivities…