3D Bioplotter Research Papers

We present a new additive-reactive synthesis method where inks – cast into molds or 3D-additively extruded into architectured shapes – are reacted into intermetallic thermoelectric compounds. The new method, as demonstrated for equiatomic TiNiSn, combines: (i) extrusion printing (or casting) of inks containing Ni and Ti powders, (ii) debinding and reactive sintering to form a porous NiTi network, (iii) network infiltration with liquid Sn and subsequent reaction to synthesize the TiNiSn phase. Thin plates, created through this method, show high phase purity and low residual porosity. A thermoelectric figure of merit  = 0.47 ± 0.05 is achieved at 800 K, within the broad range…

Ni-Co-Fe-based high-entropy superalloys (HESAs) are fabricated into microlattices via a three-step process: (i) layer-by-layer extrusion of inks containing elemental powders (Ni, Co, Fe, Cr, Ti) and TiAl3 powders; (ii) sintering to densify and homogenize the struts; (iii) aging to achieve a γ/γ’ microstructure. The struts of the microlattices show a nearly pore-free and fully-homogenized microstructure. Increasing the Ti concentration from 4 at% (Al9Co26Cr7Fe16Ni38Ti4) to 9 at% (Al8Co25Cr7Fe15Ni36Ti9) leads to a significant increase in the volume fraction of strengthening γ’ precipitates, from 51 to 78 %. Furthermore, in the Ti-rich composition, the γ’ precipitates exhibit a sharp-edged cubic morphology with larger…

Bulk Ni samples were additively manufactured using particle-based ink extrusion. Three samples were characterized for thermoelectric transport properties including electrical resistivity, thermal conductivity, Seebeck coefficient, and thermoelectric figure of merit. Sample-to-sample deviations in transport were small but observable; these were attributed to stochastic porosity from the manufacturing method. Transport results were compared to previously published results in both porous and dense Ni, indicating that the salient features in the traditionally manufactured Ni samples are maintained in their additively manufactured counterparts. These results are offered as evidence of the feasibility of using particle-based ink extrusion additive manufacturing for thermoelectric applications.

Porous materials, including foams and lattice structures, are used in many applications such as biomedical implants, heat exchangers, catalysts, and batteries due to their light weight, high surface area and energy absorption properties. Lattice structures, specifically, are of great interest since their properties can be tailored by employing various design methodologies (e.g., topology optimization). On the other hand, Ni-based superalloys are used in many applications where high-temperature and oxidation/corrosion resistance are important such as in gas turbine components. The advantageous properties of these Ni-Cr-Al-based alloys with the geometry and tailored mechanical properties of lattice structures can be combined through a…

Additive manufacturing is becoming an increasingly attractive method for the fabrication of devices in both industry applications and materials science research. Comparatively, conventional synthesis methods are often more time-intensive and provide geometric constraints. This is true for the fabrication of thermoelectric devices, where additive manufacturing is being further explored to improve cost and design flexibility. Currently, little work has been conducted on the direct effects between additive manufacturing fabrication methods and if or how thermoelectric transport properties are altered from these methods. This work focuses on the process development of constructing bulk Ni samples via particle-based ink extrusion printing, where…

The capacity for a soft material to combine remote sensing and remote actuation is highly desirable for many applications in soft robotics and wearable technologies. This work presents a silicone elastomer with a suspension of a small weight fraction of ferromagnetic nickel nanorods, which is capable of both sensing deformation and altering stiffness in the presence of an external magnetic field. Cylinders composed of silicone elastomer and 1% by weight nickel nanorods experience large increases in compressive modulus when exposed to an external magnetic field. Incremental compressions totaling 600 g of force applied to the same silicone–nanorod composites increase the…

3D ink-extrusion of powders followed by sintering is an emerging alternative to beam-based additive manufacturing, capable of creating 3D metallic objects from 1D-extruded microfilaments. Here, in situ synchrotron X-ray diffraction and tomography are combined to study the phase evolution, alloy formation and sinter-densification of Fe-20Ni-5Mo (at.%) microfilaments. The filaments are

Ni-29Mn-21.5Ga (at. %) wires are fabricated via a combination of (i) extrusion of liquid inks containing a binder, solvents, and elemental Ni, Mn, and Ga powders and (ii) heat treatments to remove the polymer binder and to interdiffuse and sinter the powders. To study the microstructural evolution, sintering mechanisms, and grain growth in these wires, both ex situ metallography and in situ X-Ray tomography were conducted while sintering at 800–1050 °C for up to 4 h. After debinding, Ga-rich regions melt and induce transient liquid phase sintering of the surrounding Ni and Mn powders, resulting in localized swelling of the wires and…

Ni-Mn-Ga magnetic shape memory alloy (SMA) micro-trusses, suitable for high magnetic field induced strains and/or a large magnetocaloric effect, are created via a new additive manufacturing method combining (i) 3D-printing ∼400 μm struts with an ink containing a polymer binder and elemental Ni, Mn, and Ga powders, (ii) binder burn-out and metallic powder interdiffusion and homogenization to create the final alloy, and (iii) further sintering to increase strut density. Controlled amounts of hierarchical porosity, desirable to enable twinning in this polycrystalline alloy, are achieved: (i) continuous ∼450 μm channels between the printed Ni-Mn-Ga ∼300 μm diameter struts (after sintering) and…